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FMA3008
2-20GHZ BROADBAND MMIC AMPLIFIER
FEATURES:
* * * * * 23 dBm Output Power 11dB Gain pHEMT Technology Input Return Loss < -8dB Output Return Loss < -10dB
Production Datasheet v2.9
FUNCTIONAL SCHEMATIC:
VDD RF Input RF Output
GENERAL DESCRIPTION:
The FMA3008 is a high performance 2-20GHz Gallium Arsenide monolithic travelling wave amplifier. It is suitable for use in broadband communication, instrumentation and electronic warfare applications. The die is fabricated using the Filtronic 0.25m process. The amplifier is DC blocked at both the input and output.
VG
TYPICAL APPLICATIONS:
* * * Test Instrumentation Electronic Warfare Broadband Communication Infrastructure
ELECTRICAL SPECIFICATIONS:
PARAMETER
Small Signal Gain Small Signal Gain Input Return Loss Output Return Loss Reverse Isolation Output Power at 1dB compression point
CONDITIONS 1, 2, 3
2-12GHz 12-20GHz 2-20GHz 2-20GHz 2-20GHz 2GHz 10GHz 20GHz
MIN
10 11 18 16.5 16 90 -
TYP
11 12 -10 -15 < -30 23.5 23.5 20 4.5 140 7.0
MAX
11.5 13.5 -8 -10 -23 8 6.5 160 -
UNITS
dB dB dB dB dB dBm dBm
Noise Figure Noise Figure Drain Current Drain Voltage
2 - 4.5 GHz 4.5 - 20GHz For Vg = -0.28V
dB dB mA V
Notes: 1. TAmbient = +25C 2. Device is biased at constant gate voltage, measured on wafer with Z0 = 50 3. Measurement Conditions VG= -0.28V, VDD= 7V
1
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input Power Gate Voltage Drain Voltage Total Power Dissipation Gain Compression Thermal Resistivity Operating Temp Storage Temp
PAD LAYOUT:
PAD REF
A B C D
SYMBOL
Pin VG1 VDD
ABSOLUTE MAXIMUM
+20dBm -2V +10V
PAD NAME
RF in GND VG Out GND VD
DESCRIPTION
PIN COORDINATES (m)
(105,713) (198, 126) (461, 128) (663, 713) (2170, 1580) (1998, 1580)
RF in Ground Gate Voltage RF Output Ground Drain Voltage
Ptot
tbd
Comp
tbd 38C/W -40C to +85C -55C to +150C
JC
Toper Tstor
E F
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening
Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device.
F
E
A
D
B
C
DIE SIZE (m)
2350 x 1710
DIE THICKNESS (m)
100
MIN. BOND PAD PITCH (m)
179
MIN. BOND PAD OPENING (m x m )
100 x 100
2
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS:
Note: Measurement Conditions VG= -0.28V, VDD= 7V, TAMBIENT = 25C
P1dB
30 25
P 1d B (d B)
20 15 10 5 0 2 10 Frequency (GHz) 20
3
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
TYPICAL MEASURED PERFORMANCE FOR ON WAFER TEMPERATURE MEASUREMENTS:
Note: Measurement Conditions VG= -0.28V, VDD= 7V, TAMBIENT = -40C to +85C
4
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
S-PARAMETERS FOR ON WAFER MEASUREMENTS:
Note: Measurement Conditions VG= -0.28V, VDD= 7V.
S11 S21 S12 S22 Frequency Mag Angle Mag Angle Mag Angle Mag Angle 2 0.25 43.20 0.25 43.20 0.25 43.20 0.25 43.12 2.19 0.25 39.39 0.25 39.39 0.25 39.39 0.25 39.31 2.38 0.26 35.85 0.26 35.85 0.26 35.85 0.26 35.77 2.57 0.26 32.34 0.26 32.34 0.26 32.34 0.26 32.27 2.76 0.26 28.94 0.26 28.94 0.26 28.94 0.26 28.86 2.95 0.27 25.69 0.27 25.69 0.27 25.69 0.27 25.60 3.14 0.27 22.45 0.27 22.45 0.27 22.45 0.27 22.36 3.33 0.28 19.13 0.28 19.13 0.28 19.13 0.28 19.05 3.52 0.28 15.98 0.28 15.98 0.28 15.98 0.28 15.89 3.71 0.28 12.78 0.28 12.78 0.28 12.78 0.28 12.71 3.9 0.29 9.46 0.29 9.46 0.29 9.46 0.29 9.39 4.09 0.29 6.29 0.29 6.29 0.29 6.29 0.29 6.22 4.28 0.29 3.02 0.29 3.02 0.29 3.02 0.29 2.95 4.47 0.29 -0.34 0.29 -0.34 0.29 -0.34 0.29 -0.39 4.66 0.29 -3.65 0.29 -3.65 0.29 -3.65 0.29 -3.70 4.85 0.29 -6.96 0.29 -6.96 0.29 -6.96 0.29 -7.03 5.04 0.29 -10.37 0.29 -10.37 0.29 -10.37 0.29 -10.44 5.23 0.29 -13.76 0.29 -13.76 0.29 -13.76 0.29 -13.81 5.42 0.29 -17.11 0.29 -17.11 0.29 -17.11 0.29 -17.17 5.61 0.29 -20.57 0.29 -20.57 0.29 -20.57 0.29 -20.62 5.8 0.29 -24.15 0.29 -24.15 0.29 -24.15 0.29 -24.20 5.99 0.28 -27.59 0.28 -27.59 0.28 -27.59 0.28 -27.63 6.18 0.28 -31.36 0.28 -31.36 0.28 -31.36 0.28 -31.41 6.37 0.28 -35.15 0.28 -35.15 0.28 -35.15 0.28 -35.19 6.56 0.27 -38.98 0.27 -38.98 0.27 -38.98 0.27 -39.02 6.75 0.27 -42.83 0.27 -42.83 0.27 -42.83 0.27 -42.87 6.94 0.26 -46.73 0.26 -46.73 0.26 -46.73 0.26 -46.77 7.13 0.25 -50.63 0.25 -50.63 0.25 -50.63 0.25 -50.67 7.32 0.24 -54.69 0.24 -54.69 0.24 -54.69 0.24 -54.74 7.51 0.23 -59.03 0.23 -59.03 0.23 -59.03 0.23 -59.07 7.7 0.23 -63.47 0.23 -63.47 0.23 -63.47 0.23 -63.49 7.89 0.21 -68.15 0.21 -68.15 0.21 -68.15 0.21 -68.19 8.08 0.20 -72.89 0.20 -72.89 0.20 -72.89 0.20 -72.91 8.27 0.19 -78.03 0.19 -78.03 0.19 -78.03 0.19 -78.05 8.46 0.18 -83.18 0.18 -83.18 0.18 -83.18 0.18 -83.23 8.65 0.17 -88.76 0.17 -88.76 0.17 -88.76 0.17 -88.79 8.84 0.15 85.32 0.15 85.32 0.15 85.32 0.15 85.28 9.03 0.14 78.70 0.14 78.70 0.14 78.70 0.14 78.66 9.22 0.13 71.12 0.13 71.12 0.13 71.12 0.13 71.08 9.41 0.11 62.64 0.11 62.64 0.11 62.64 0.11 62.61 9.6 0.10 52.12 0.10 52.12 0.10 52.12 0.10 51.99 9.79 0.08 40.06 0.08 40.06 0.08 40.06 0.08 39.94 9.98 0.07 24.48 0.07 24.48 0.07 24.48 0.07 24.35 10.17 0.07 5.78 0.07 5.78 0.07 5.78 0.07 5.64 10.36 0.07 -15.15 0.07 -15.15 0.07 -15.15 0.07 -15.29 10.55 0.07 -36.45 0.07 -36.45 0.07 -36.45 0.07 -36.55 10.74 0.08 -54.27 0.08 -54.27 0.08 -54.27 0.08 -54.38 10.93 0.09 -69.24 0.09 -69.24 0.09 -69.24 0.09 -69.28
5
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
S-PARAMETERS CONTINUED
S11 S21 S12 S22 Frequency Mag Angle Mag Angle Mag Angle Mag Angle 11.12 0.11 -81.40 0.11 -81.40 0.11 -81.40 0.11 -81.40 11.31 0.12 52.68 0.12 52.68 0.12 52.68 0.12 52.62 11.5 0.14 80.39 0.14 80.39 0.14 80.39 0.14 80.37 11.69 0.16 72.58 0.16 72.58 0.16 72.58 0.16 72.57 11.88 0.18 65.41 0.18 65.41 0.18 65.41 0.18 65.40 12.07 0.20 58.92 0.20 58.92 0.20 58.92 0.20 58.93 12.26 0.21 52.93 0.21 52.93 0.21 52.93 0.21 52.96 12.45 0.23 47.30 0.23 47.30 0.23 47.30 0.23 47.36 12.64 0.25 41.82 0.25 41.82 0.25 41.82 0.25 41.87 12.83 0.26 36.47 0.26 36.47 0.26 36.47 0.26 36.54 13.02 0.28 31.06 0.28 31.06 0.28 31.06 0.28 31.14 13.21 0.29 25.89 0.29 25.89 0.29 25.89 0.29 25.96 13.4 0.30 20.96 0.30 20.96 0.30 20.96 0.30 21.04 13.59 0.31 15.93 0.31 15.93 0.31 15.93 0.31 16.00 13.78 0.32 11.04 0.32 11.04 0.32 11.04 0.32 11.15 13.97 0.33 6.08 0.33 6.08 0.33 6.08 0.33 6.16 14.16 0.34 1.08 0.34 1.08 0.34 1.08 0.34 1.19 14.35 0.34 -3.80 0.34 -3.80 0.34 -3.80 0.34 -3.68 14.54 0.35 -8.44 0.35 -8.44 0.35 -8.44 0.35 -8.32 14.73 0.35 -12.99 0.35 -12.99 0.35 -12.99 0.35 -12.89 14.92 0.36 -17.67 0.36 -17.67 0.36 -17.67 0.36 -17.55 15.11 0.36 -22.44 0.36 -22.44 0.36 -22.44 0.36 -22.32 15.3 0.35 -27.66 0.35 -27.66 0.35 -27.66 0.35 -27.51 15.49 0.35 -32.82 0.35 -32.82 0.35 -32.82 0.35 -32.67 15.68 0.35 -37.57 0.35 -37.57 0.35 -37.57 0.35 -37.42 15.87 0.34 -42.54 0.34 -42.54 0.34 -42.54 0.34 -42.40 16.06 0.33 -47.81 0.33 -47.81 0.33 -47.81 0.33 -47.65 16.25 0.33 -52.82 0.33 -52.82 0.33 -52.82 0.33 -52.65 16.44 0.31 -58.18 0.31 -58.18 0.31 -58.18 0.31 -57.99 16.63 0.30 -63.88 0.30 -63.88 0.30 -63.88 0.30 -63.68 16.82 0.28 -69.25 0.28 -69.25 0.28 -69.25 0.28 -69.04 17.01 0.26 -74.77 0.26 -74.77 0.26 -74.77 0.26 -74.53 17.2 0.23 -80.74 0.23 -80.74 0.23 -80.74 0.23 -80.46 17.39 0.21 -86.96 0.21 -86.96 0.21 -86.96 0.21 -86.66 17.58 0.18 50.66 0.18 50.66 0.18 50.66 0.18 50.98 17.77 0.15 78.36 0.15 78.36 0.15 78.36 0.15 78.72 17.96 0.11 69.56 0.11 69.56 0.11 69.56 0.11 70.01 18.15 0.07 58.88 0.07 58.88 0.07 58.88 0.07 59.64 18.34 0.03 30.46 0.03 30.46 0.03 30.46 0.03 33.13 18.53 0.03 -25.89 0.03 -25.89 0.03 -25.89 0.03 -23.99 18.72 0.06 70.21 0.06 70.21 0.06 70.21 0.06 70.75 18.91 0.11 56.90 0.11 56.90 0.11 56.90 0.11 57.25 19.1 0.16 47.25 0.16 47.25 0.16 47.25 0.16 47.65 19.29 0.21 38.16 0.21 38.16 0.21 38.16 0.21 38.57 19.48 0.26 30.13 0.26 30.13 0.26 30.13 0.26 30.57 19.67 0.31 22.29 0.31 22.29 0.31 22.29 0.31 22.68 19.86 0.35 14.93 0.35 14.93 0.35 14.93 0.35 15.36 20 0.39 7.63 0.39 7.63 0.39 7.63 0.39 8.08
6
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
BIASING CIRCUIT SCHEMATIC:
VDD 100pF 100nF
RF Input RF Output VG 100nF 100pF
ASSEMBLY DIAGRAM:
It is recommended that the RF connections be made using two bond wires 25m in diameter and a maximum length of 300m. Optimum input and output return loss can be achieved, to compensate for bond wire length, with the addition of a microstrip transformer, shown in the diagram below.
To Evaluation Board via an 0402 Surface Mounted capacitor 100pF Chip Capacitor
Substrate: Alumina Thickness: 635m Dimensions in mm 1.1 0.61 1.1 0.61
0.65
100pF Chip Capacitors
0.65
Transformer Impedance 36
Electrical Length 21 at 10GHz
To Evaluation Board via an 0402 Surface Mounted capacitor
BILL OF MATERIALS:
COMPONENT
All RF tracks should be 50 characteristic material Capacitor, 100pF, chip capacitor Capacitor, 100pF, 0402
7
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3008
Production Datasheet v2.9
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimised especially when making RF or ground connections.
ORDERING INFORMATION:
PART NUMBER
FMA3008 (Gel-pak available on request)
DESCRIPTION
Die in Waffle-pack
HANDLING PRECAUTIONS:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 0 (0-250 V) as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MILHDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including Sparameters, noise data are available on request.
DISCLAIMERS:
This product is not designed for use in any space based or life sustaining/supporting equipment.
8
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com

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